Welcome to WCMEIM 2020

To upgrade China's manufacturing industry and realize transformation from a manufacturing giant to a global high-tech manufacturing power, China must to speed up development of intelligent manufacturing, advance further integration of information technology with industrialization, and strive for revolutionary improvement in quality, efficiency and the driving force of the manufacturing sector. The 2020 3rd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM 2020)[2020年第三届机械工程与智能制造国际会议] is organized by Shanghai University of Engineering Science, and will be held in Shanghai, China during December 4-6, 2020.

Focused on hot research topics and difficulties in intelligent manufacturing, this conference will explore cutting-edge intelligent manufacturing technologies, share typical study cases and encourage scientific innovation in this field. Renowned experts and academics in relevant fields will be invited to this conference to deliver keynote speeches, present reports and exchange ideas with attendees on research advancements and challenges.

Call for paper & Submission Guides
This conference will provide an excellent opportunity for everyone involved to learn and discuss about mechanical automation and intelligent manufacturing. Prospective author are welcome to submit the full manuscript.
Topics of interest for submission include, but are not limited to:
Intelligent control technology
Intelligent manufacturing
Computer integrated manufacturing system
Virtual Manufacturing and Network Manufacturing
More Topics...

The papers should adhere to the Template! All the papers will be peer reviewed by 2-3 experts. It takes 1-2 weeks for the result coming out. If the paper needs revising, it should be resubmited for peer review again.The full paper should be no less than 4 pages, including figures,tables and references. Plagiarism is prohibited.
For more details about paper submission, please click!
For full papers submitted to WCMEIM 2020, after the peer reviewing process by at least 2-3 experts. All the accepted papers will be published into conference proceedings, which will be submitted to, EI Compendex, Scopus for indexing.

WCMEIM Overview
WCMEIM 2019:
Shanghai | Nov. 22-24
WCMEIM 2019 was reported by Shanghai University of Engineering Science! (Click link!)
WCMEIM 2019 was reported by Tencent! (Link 1, Link 2)
EI Compendex
Scopus Index
IEEE Xplore


Latest News

  • April 28, 2020
    WCMEIM 2020 will be held on December 4-6, 2020 in Shanghai, China. (Click)
  • March 27, 2020
    WCMEIM 2019 has been indexed by EI Compendex and Scopus! (Click)
  • February 20, 2020
    WCMEIM 2019 conference proceedings has been archived in IEEE Xplore! (Click)
  • November 26, 2019
    WCMEIM 2019 was successfully taken place on November 22-24, 2019 in Shanghai University of Engineering Science, China! (Click)
  • November 15, 2019
    Welcome Prof.Ngo, University of Applied Sciences Berlin and Fraunhofer Institute for Reliability and Microintegration,Germany to be the TPC! (Click)

Important Dates

Submission Deadline: October 18, 2020

Registration Deadline: November 4, 2020

Conference Date: December 4-6, 2020

Organized by


Sponsored by







Contact Us

Conference Secretary

Mr. Zheng

Email: wcmeim@yeah.net

QQ: 2556533101

Tel: +86-18420103136

(Office Time 9:00 - 17:30, Time zone: GMT+8; Monday to Friday)