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Welcome Prof.Ngo, University of Applied Sciences Berlin and Fraunhofer Institute for Reliability and Microintegration,Germany to be the TPC!


Prof.Ngo, University of Applied Sciences Berlin and Fraunhofer Institute for Reliability and Microintegration,Germany

Ha-Duong Ngo studied in Vietnam, Russia and Germany. He got Diplom degree at the Technical University Chemnitz (Germany) on Microsystems Engineering and PhD at the Technical University Berlin on MEMS and Electrical Engineering. He joined Bosch in 1999 and worked in the world well known department for Microsensors in surface micromachining in the projesct world-first gyroscope in silicon for automotive applications. He was at the Technical University Berlin as Assistant Professor on MEMS and Sensors, where he invented many innovative sensors and microsystem solutions for industry and R&D, such as sensors for sensing of gas concentration and physical properties. He also joined the company SCHOTT in Germany, where he invented the innovative microsystems packaging using TSV (Through Silicon Vias) and transferred in into production.  Now he is with the University of Applied Sciences and the large Research Institute IZM on Sensors and Microsystems in Berlin. He is leading many funded research projects. He is author and co-author of many book chapters, papers and patents in the field. 

Important Dates

Submission Deadline: August 20, 2019
November 8, 2019

Registration Deadline: November 18, 2019

Conference Date: November 22-24, 2019

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