Welcome Assoc.Prof.Xinrui Ding,School of Mechanical and Automotive Engineering,South China University of Technology,China to be the TPC!
Assoc. Prof.Xinrui Ding,School of Mechanical and Automotive Engineering,South China University of Technology,China
XIN-RUI DING received the Ph.D. degree in mechanical engineering from the South China University of Technology, Guangzhou, China, in 2015. From 2015 to 2017, he was with the Mechanical Engineering Department, University of California at Berkeley, as a Postdoctoral Researcher. Since 2018, he has been with the National and Local Joint Engineering Research Center of Semiconductor Display and Optical Communication Devices, South China University of Technology, as an Associate Professor. He has published more than 60 research papers, authorized more than 10 patents. He has achieved the Science and Technology Award of the Guangdong Province in 2017, the Excellence Patent Award of China in 2018. He has served many scientific journals and conferences as a peer reviewer. He was selected as the outstanding reviewer of Applied Thermal Engineering in 2017. He was selected as the section chair (Display and lighting) of the 20th International Conference On Electronic Packaging Technology(ICEPT). His current research interests include the thermal management of high-power electron device, QDs materials, LED/LD packaging, optical designing, laser display and illumination.
August 20, 2019
November 8, 2019
Registration Deadline: November 18, 2019
Conference Date: November 22-24, 2019
(Office Time 9:00 - 17:30, Time zone: GMT+8; Monday to Friday)